BrikoXM to AMDEnglish · 16 hours agoAMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new techwww.tomshardware.comexternal-linkmessage-square0fedilinkarrow-up125arrow-down10file-textcross-posted to: [email protected]
arrow-up125arrow-down1external-linkAMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new techwww.tomshardware.comBrikoXM to AMDEnglish · 16 hours agomessage-square0fedilinkfile-textcross-posted to: [email protected]
