BrikoXM to Hardware@programming.devEnglish · 26 days agoTSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stackswww.tomshardware.comexternal-linkmessage-square0fedilinkarrow-up14arrow-down10file-textcross-posted to: [email protected]
arrow-up14arrow-down1external-linkTSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stackswww.tomshardware.comBrikoXM to Hardware@programming.devEnglish · 26 days agomessage-square0fedilinkfile-textcross-posted to: [email protected]