BrikoXM to IntelEnglish · 13 days agoIntel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024www.tomshardware.comexternal-linkmessage-square0fedilinkarrow-up16arrow-down11file-textcross-posted to: [email protected][email protected]
arrow-up15arrow-down1external-linkIntel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024www.tomshardware.comBrikoXM to IntelEnglish · 13 days agomessage-square0fedilinkfile-textcross-posted to: [email protected][email protected]