Takes a long time and risks creating voids that offgas or pop during reflow. Currently there are options for conductive copper filled epoxies. This appears to use a combination of copper slugs / disks and chemical deposition to save time and avoid voids in the larger central area.
Is there a particular reason this can’t be done as layers are deposited?
Takes a long time and risks creating voids that offgas or pop during reflow. Currently there are options for conductive copper filled epoxies. This appears to use a combination of copper slugs / disks and chemical deposition to save time and avoid voids in the larger central area.